CXF-250/2301
Keywords: CXF-250/2301
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CXF-250/2301
Product Features
● Energy-saving: No friction, avoiding frictional heat loss, energy consumption reduced by 30% compared to other types of products
● High efficiency: Longer continuous working time, high airflow, and high pumping speed
● Flexibility: Compact structure, meets the need for smaller physical space, can be installed at any angle, suitable for various design requirements, rich expansion functions to meet customer customization needs
Technical Specifications
Inlet Flange | DN250 ISO F (standard) DN250 CF (optional) DN250 LF (customizable) | Outlet Flange | KF40 |
Pumping Speed Rate (L/s) | N2:2150 Ar:1900 He:1500 H2:850 | Compression Ratio | N2:>1E8 Ar:>1E8 He:>1E4 H2:>1E3 |
Ultimate Pressure (Pa) | 1E-7 (rubber seal) 1E-8 (metal seal) | Maximum Instantaneous Inlet Flow (sccm) | 1300 |
Protective Gas Inlet Flange (optional) | KF10 | Recommended Protective Gas Flow | 50 |
Maximum Allowable Magnetic Field Strength | Radial: 3 Axial: 15 | Rated Speed (rpm) | 27000 |
Startup Time (min) | ≤8 | Shutdown Time (min) | ≤11 |
Cooling Method | Water Cooling | Cooling Water Flow (L/min) | 3 |
Recommended Cooling Water Temperature (℃) | 20±5 | Power Supply (V AC) | 220±10%, 50Hz 110±10%, 60Hz |
Compatible Power Supply Model | CXFD-1601 | Recommended Forepump | >=22 |
Application Fields
Scientific Research
Accelerators
Photovoltaics
Low-E Glass Coating
ITO Coating
Optical Coating
Decorative Coating
Flat Panel Display
Vacuum Furnace
Electric Vacuum
New Energy
New Materials
Vacuum Drying
Cryogenic Cooling
Thin Film Deposition
Etching
Ion Implantation
Photolithography
Electronic Devices
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